@article{oai:tobunken.repo.nii.ac.jp:00005759,
 author = {古田嶋, 智子 and 呂, 俊民 and 佐野, 千絵 and 稲葉, 政満 and Tomoko, KOTAJIMA and Toshitami, RO and Chie, SANO and Masamitsu, INABA},
 issue = {57},
 journal = {保存科学, Science for conservation},
 month = {Mar},
 note = {Organic acid emission from wood materials,such as plywood,poses a major challenge in museums because it may cause adverse effects on artifacts. It has been observed that emissions of acetic acid, formic acid and ammonia from plywood vary according to adhesives used.This suggests that they may be emitted from the adhesives.To investigate their emissions from adhesives used on wood materials,emission test was conducted by the chamber method. Major adhesives for wood materials, urea resin (UF), meramine-urea resin (MUF), phenol resin (PF1,PF2)and aqueous polymer-isocyanate (API)were used as test samples.
It was found that formic acid and ammonia emissions from MUF and UF were greater than from PF1,PF2and API.Acetic acid emission from API was greater than from other adhesives. These emissions were caused by components of each adhesive and curing reaction but had little influence after curing. However, choosing adhesives with smaller emission is preferable because wood materials using adhesives that emit a large amount of chemicals on curing have the risk of chemicals remaining and leading to further gradual emission.},
 pages = {159--167},
 title = {〔報告〕木質材料に用いる接着剤からの有機酸とアンモニアの放散},
 year = {2018}
}